Electroless Nickel Plating of Complicated Weldments for Equipment Used in a Clean Room Environment in the Semi-Conductor IndustryWorking with ASTM A1011 as a base material, IMF conducted electroless nickel plating of a steel weldment intended for use in a semiconductor industry cleanroom environment. The applied material thickness was 0.0004” to 0.0006”, and the part measured 29” long, 18” wide, 19” high, and weighed 175 lbs. The final component met ASTM B733 standards and was free of all streaks and contamination, and therefore was ready for use in a cleanroom application for the semiconductor industry. (click on thumbnail to enlarge)
Specifications| Capabilities Applied/Processes: | Electroless Nickel Plating | | Base Material: | ASTM A1011 | | Material Thickness Applied: | 0.0004"-0.0006" | | Product Length: | 29" | | Product Width: | 18" | | Product Height: | 19" | | Product Weight: | 175 lbs | | Special Feature: | Part Must be free of all streaks and contamination | | Industry for Use: | semi-conductor | | Volume: | 12/week | | Standards Met: | ASTM B733 | | Product Name: | Storage Frame | | Product Description | Steel Weldment |
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