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PORTFOLIOSElectroless Nickel Plating of Complicated Weldments for Equipment Used in a Cleanroom Environment in the
Semi-Conductor Industry
Pickle & Passivation of Stainless Steel Fabrications for Equipment Used in the Semi-Conductor IndustryVibratory Deburring of Steel Rings Used in the Automotive Industry

Electroless Nickel Plating of Complicated Weldments for Equipment Used in a Clean Room Environment in the Semi-Conductor Industry

Working with ASTM A1011 as a base material, IMF conducted electroless nickel plating of a steel weldment intended for use in a semiconductor industry cleanroom environment. The applied material thickness was 0.0004” to 0.0006”, and the part measured 29” long, 18” wide, 19” high, and weighed 175 lbs.  The final component met ASTM B733 standards and was free of all streaks and contamination, and therefore was ready for use in a cleanroom application for the semiconductor industry.

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Electoless Nickel Plating Electoless Nickel Plating


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Specifications

Capabilities Applied/Processes:Electroless Nickel Plating
Base Material:ASTM A1011
Material Thickness Applied: 0.0004"-0.0006"
Product Length:29"
Product Width:18"
Product Height:19"
Product Weight:175 lbs
Special Feature:Part Must be free of all streaks and contamination
Industry for Use:semi-conductor 
Volume:12/week
Standards Met:ASTM B733
Product Name:Storage Frame
Product DescriptionSteel Weldment